CGA5L1X7R2A475KT0Y0N 代理TDK
-
尺寸
| 長(zhǎng)度(L) |
- 3.20mm +0.30,-0.10mm
|
| 寬度(W) |
- 1.60mm +0.30,-0.10mm
|
| 厚度(T) |
- 1.60mm +0.30,-0.10mm
|
| 端子寬度(B) |
- 0.20mm Min.
|
| 端子間隔(G) |
- 1.00mm Min.
|
| 推薦焊盤(pán)布局(PA) |
- 2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
|
| 推薦焊盤(pán)布局(PB) |
- 1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
|
| 推薦焊盤(pán)布局(PC) |
- 1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)
|
電氣特性
| 電容 |
- 4.7μF ±10%
|
| 額定電壓 |
- 100VDC
|
溫度特性  |
- X7R(±15%)
|
| 耗散因數(shù) (Max.) |
- 5%
|
| 絕緣電阻 (Min.) |
- 21MΩ
|
其他
| 溫度范圍 |
- -55～125°C
|
| 焊接方法 |
- 流體
- 回流
|
| AEC-Q200 |
- YES
|
| 包裝形式 |
- 塑封編帶 (180mm卷筒)
|
| 包裝個(gè)數(shù) |
- 2000pcs
|
